The organizers of the SIGGRAPH 2013 Technical Papers program have revealed details of what those looking for the latest in scholarly work related to computer graphics and interactive techniques can look forward to at the 40th conference and exhibit, taking place July 21-25 at the Anaheim Convention Center.
“Computer Graphics is a dynamic and ever-changing field in many ways,” says Marc Alexa, SIGGRAPH 2013 Technical Papers Chair from Technische Universität Berlin. “The range of ground-breaking papers presented at SIGGRAPH is getting broader every year, now also encompassing 3D printing, and fabricating realistic materials as well as generating ever more realistic images of complex phenomena.”
115 technical papers out of 480 submissions were accepted this year, representing an acceptance rate of 24 percent (one percent higher than 2012). The selected papers were chosen by a distinguished committee of academia and industry experts. This year’s Technical Papers program also includes conference presentations for 37 papers published this year in the journal ACM Transactions on Graphics (TOG).
Here are some highlights of the program:
OpenFab: A Programmable Pipeline for Multi-Material Fabrication
Authors: Kiril Vidimce, Szu-Po Wang, Jonathan Ragan-Kelley and Wojciech Matusik, Massachusetts Institute of Technology CSAIL
OpenFab is a programmable pipeline for synthesis of multi-material 3D printed objects that is inspired by RenderMan and modern GPU pipelines. It supports procedural evaluation of geometric detail and material composition, using shader-like fablets. It is implemented in a streaming fashion within a fixed memory usage target.
Opacity Optimization for 3D Line Fields
Authors: Tobias Günther, Christian Roessl, and Holger Theisel, Otto-von-Guericke-Universität Magdeburg
For visualizing dense line fields, this method selects lines by view-dependent opacity optimizations and applies them to real-time free navigation in flow data, medical imaging, physics, and computer graphics.
AIREAL: Interactive Tactile Experiences in Free Air
Authors: Rajinder Sodhi, University of Illinois; Ivan Poupyrev, Matthew Glisson, Ali Israr, Disney Research, The Walt Disney Company
AIREAL is a tactile feedback device that delivers effective and expressive tactile sensations in free air, without requiring the user to wear a physical device. Combined with interactive graphics and applications, AIREAL enables users to feel virtual objects, experience free-air textures and receive haptic feedback with free-space gestures.
Bi-Scale Appearance Fabrication
Authors: Yanxiang Lan, Tsinghua University; Yue Dong, Microsoft Research Asia; Fabio Pellacini, Sapienza Universita’ Di Roma, Dartmouth College; Xin Tong, Microsoft Research Asia
A system for fabricating surfaces with desired spatially varying reflectance, including anisotropic ones, and local shading frames.
Map-Based Exploration of Intrinsic Shape Differences and Variability
Authors: Raif Rustamov, Stanford University; Maks Ovsjanikov, École Polytechnique; Omri Azencot, Mirela Ben-Chen, Technion – Israel Institute of Technology; Frederic Chazal, INRIA Saclay – Île-de-France; and Leonidas Guibas, Stanford University
A novel formulation of shape differences, aimed at providing detailed information about the location and nature of the differences or distortions between the shapes being compared. This difference operator is much more informative than a scalar similarity score, so it is useful in applications requiring more refined shape comparisons.
Highly Adaptive Liquid Simulations on Tetrahedral Meshes
Authors: Ryoichi Ando, Kyushu University; Nils Thuerey, ScanlineVFX GmbH; and Chris Wojtan, Institute of Science and Technology Austria
This new method for efficiently simulating fluid simulations with extreme amounts of spatial adaptivity combines several key components to produce a simulation algorithm that is capable of creating animations at high effective resolutions while avoiding common pitfalls like inaccurate boundary conditions and inefficient computation.
Visit s2013.siggraph.org for more information on this year’s event.
